Semiconductor Packaging Engineer - 22010111

Location: United States
Full-Time

Job Title: Semiconductor Packaging Engineer

Department: Sales

Region: Sunnyvale, CA

COMPANY DESCRIPTION:

Quanergy’s (NYSE: QNGY and QNGY.WS) mission is to create powerful, affordable smart LiDAR solutions for automotive and IoT applications to enhance people’s experiences and safety. Quanergy has developed the only true 100% solid-state CMOS LiDAR sensor built on optical phased array (OPA) technology to enable the mass production of low-cost, highly reliable 3D LiDAR solutions. Through Quanergy’s smart LiDAR solutions, businesses can now leverage real-time, advanced 3D insights to transform their operations in a variety of industries including industrial automation, physical security, smart cities, smart spaces and much more. Quanergy solutions are deployed by nearly 400 customers across the globe.

JOB DESCRIPTION:

Quanergy is seeking a Packaging Engineer to productize sensor technologies and work closely with cross functional teams internally and externally to bring best practices and contribute to our culture and next phase of growth. We are looking for someone exceptionally capable, creative, driven, who is a great communicator and explainer, and just as passionate about the future of 3D smart sensing as we are!

CORE RESPONSIBILITIES:

Responsibilities include, but are not limited to, the following:

The Packaging Engineer will develop and commercialize exciting new technologies for our advanced LiDAR sensors and system solutions.
Create mechanical models & BOMs.
Perform mechanical/thermal simulation and characterization.
Select optoelectronic packaging materials for performance and reliability.
Engage with internal and external manufactures to support new product designs and fabrications.

Proactively seek out opportunities to improve existing processes for New Product Introductions and for scale.

REQUIRED KNOWLEDGE, SKILLS & ABILITIES:

Proven track records of design, analysis and fabrication of mechanical, thermal and optical components, modules and systems involving semiconductor devices.
Track record of driving product innovation through life cycles with 3 to 5 successfully commercialized products, and can provide examples.
Basic understanding of optoelectronic systems.
Working knowledge of interconnects such as solders, epoxies and general engineering materials.
Detail-oriented, proactive, effective problem solver.
Excellent communicator able to interact with people of diverse disciplines.

EDUCATION REQUIRED:

Master’s or P.D. degree in Mechanical Engineering, Applied Physics, Electronics Packaging or related fields with five years of experience;

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